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A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects File

Eom, Tae-Kwang , Sari, Windu , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Woo Kyoung

Article Issue Date2012-10 View3
Atomic layer deposited Mo2N thin films using Mo(CO)(6) and NH3 plasma as a Cu diffusion barrier File

Joo, Yong-Hwan , Nandi, Dip K. , Ramesh, Rahul , Jang, Yujin , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2021-03 View1
Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier File

Kim, Jun Beom , Nandi, Dip K. , Kim, Tae Hyun , Jang, Yujin , Bae, Jong-Seong , Hong, Tae Eun , Kim, Soo-Hyun

Article Issue Date2019-09 View6
Cobalt titanium nitride amorphous metal alloys by atomic layer deposition File

Nam, Taewook , Lee, Chang Wan , Cheon, Taehoon , Lee, Woo Jae , Kim, Soo-Hyun , Kwon, Se-Hun , Lee, Han-Bo-Ram , Kim, Hyungjun

Article Issue Date2018-03 View3
Controlled formation of MoSe2 by MoNx thin film as a diffusion barrier against Se during selenization annealing for CIGS solar cell File

Jeon, Chan-Wook , Cheon, Taehoon , Kim, Hangil , Kwon, Min-Su , Kim, Soo-Hyun

Article Issue Date2015-09 View3
Diffusion-controlled growth of Cu thin films electrodeposited directly on atomic-layer-deposited WC diffusion barrier for Cu interconnect File

Youn, Hongmin , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2021-08 View4
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology File

Hong, Tae Eun , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Jeong-Kyu , Park, Young-Bae , Kwon, Oh Joong , Kim, Myung Jun , Kim, Jae Jeong

Article Issue Date2013-12 View0
Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu File

Jang, Yujin , Kim, Jun Beom , Hong, Tae Eun , Yeo, So Jeong , Lee, Sunju , Jung, Eun Ae , Park, Bo Keun , Chung, Taek-Mo , Kim, Chang Gyoun , Lee, Do-Joong , et al

Article Issue Date2016-04 View8
Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization File

Choi, Sang-Kyung , Kim, Hangil , Kim, Junbeam , Cheon, Taehoon , Seo, Jong Hyun , Kim, Soo-Hyun

Article Issue Date2015-09 View2
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect File

Mun, Ki-Yeung , Hong, Tae Eun , Cheon, Taehoon , Jang, Yujin , Lim, Byoung-Yong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2014-07 View3
Unveiling the electrochemical characteristics of acetonitrile-catholyte-based Na-CO2 battery File

Im, Eunmi , Mun, Jinhong , Pourasad, Saeed , Baek, Kyungeun , Ha, Jee Ho , Durmus, Yasin Emre , Tempel, Hermann , Eichel, Rüdiger-A. , Lee, Geunsik , Moon, Geon Dae , et al

Article Issue Date2023-11 View18
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